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      Cover image for Solder joint reliability prediction for multiple environments
      1. 
      by 
      Perkins, Andrew E.
      Format: 
      Call Number 
      TK7870.15 .P47 2009
      Location 
      ERESOURCES
      Publisher 
      Springer Science+Business Media, LLC,
      Available:
      Cover image for Organic field effect transistors theory, fabrication and characterization
      2. 
      by 
      Kymissis, Ioannis.
      Format: 
      Call Number 
      TK7871.95 .K96 2009
      Location 
      ERESOURCES
      Publisher 
      Springer Science+Business Media, LLC,
      Available: